Industrial NDT X ray computed tomography 3D CT scanning system for failure analysis
Detect void defects inside solder joints. By discovering defects inside solder joints, the company can timely optimize the process and improve welding performance.
Material defect detection, including accurate detection of cracks, pores, voids, looseness, uneven thickness and other defects, with detection accuracy up to micron level.
Internal layer identification of composite materials, as well as small defects, pore analysis, interface separation defect identification, etc.
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